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  1. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
    ball grid array1
    advanced packaging1
    micro BGA1
    chip scale1
    DDR II1
    FBGA1
    fold-over1
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    UBGA1
    3D packaging1
    land grid array1
    3D package1
    integrated passives1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    package solutions1
    chip scale technology1
    compliant chip1
    compliant layer1
    multi-chip1
    MBGA1
    microZ miniaturization1
    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

  2. signal integrity, high speed, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, ...

    3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces ...
    high speed2
    MCP2
    package design2
    CSP1
    BGA1
    memory modules1
    ball grid array1
    flip chip1
    signal integrity1
    advanced packaging1
    chip scale1
    DDR II1
    FBGA1
    chip scale package1
    3D packaging1
    land grid array1
    3D package1
    die stacking1
    ball stack1
    die stack1
    fine pitch BGA1
    MBGA1
    power integrity1
    CO design1
    IR drop1
    multi chip1
    reliability modeling1
    cavity down0
    memory stacking0
    multi chip package0
    substrate design0

    www.broadpak.com - 2009-02-11

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